COP30: Turning global climate goals into material change
This month, the world will gather in Belém, Brazil – the heart of the Amazon, for COP30 – the 30th UN Climate Conference and the first to be held in this vital ecosystem. It will be a milestone moment to assess how far we’ve come in the 10 years since the Paris Agreement, and how it’s now more important than ever to turn promises into action.
The focus this year will be on implementation. Not just setting targets but delivering on them. Key themes will include:
Keeping 1.5°C alive through stronger national climate commitments (NDCs)
Climate finance, adaptation and loss-and-damage to protect vulnerable communities
Nature-based solutions and the protection of ecosystems like the Amazon and the world’s oceans
Ensuring a just transition, shifting to a low-carbon economy that benefits people as well as the planet
At Kelpi, these discussions resonate deeply. Our work is rooted in the belief that materials innovation can be a powerful lever for climate action, developing 100% bio-based coatings made from seaweed that can:
Reduce carbon emissions, by replacing fossil fuel-based plastics with renewable feedstocks
Combat plastic pollution, by creating materials designed to break down safely in nature
Promote a fair and sustainable shift, by aligning business growth with positive environmental and social impact
As the world’s attention turns to Belém and the Amazon, we’re reminded that the health of our oceans, forests, and climate are inseparable. Seaweed, one of the fastest-growing, most regenerative resources on the planet, offers a model for how circular, restorative design can contribute to both decarbonisation and biodiversity.
COP30 will be a moment for governments to raise ambition, but also for businesses to demonstrate that sustainability and innovation can reinforce one another. At Kelpi, we’re proud to be part of that shift - turning scientific insight into tangible, scalable solutions that help build the low-carbon, circular economy the world urgently needs.